New HP Wireless Communication Components Improve Price And Performance For Wireless Systems And TV Distribution

World's Largest Independent Supplier of Communication Components Reaffirms Leadership with Next Generation of Semiconductors for Wireless Communication Systems

Santa Clara, California. February 14, 1996

Hewlett-Packard Company today introduced more than a dozen semiconductor products for use in wireless communication systems here at the 1996 Wireless Symposium.

The new devices from HP's Communication Components Division allow wireless-communication-systems designers to reduce the weight, size and cost of cellular phones, personal communication systems, cordless phones, data terminals and television distribution systems.

"The wireless era is here. The rapid pace of technology advancements are enabling entirely new classes of products that give end users more freedom and flexibility than ever before," said James F. (Jim) Horner, general manager of HP's Communications Components Division. "Today's announcement thrusts HP further into the forefront of this era with components that offer designers high performance, design flexibility, smaller packaging and lower costs."

1996 Wireless Symposium Product Introductions

The following products have been to HP's expanding line of wireless component solutions:

• For emerging wireless markets, such as PCS and Wireless to the Local Loop (WLL) -- MGA-81563, MGA-82563, IAM-91563 -- these are the industry's smallest 3-volt GaAs RFIC amplifiers and mixers.

• For cellular, PCS and other digital wireless applications -- HPMX-2007 -- this is the smallest 3-volt modulator/mixer on the market.

• For cordless, US PCS and Wireless LAN (WLAN) applications -- HPMX-5001, HPMX-5002 and HPMX-3003 -- this 1.5GHz - 2.5 GHz chip set contains nearly all of the active RF functionality for several standards.

• For DBS satellite receiver systems -- HPMR-1001, HPMR-1002 -- this is the industry's first silicon Ku band downconverter IC.

• For DBS and TV receive only systems -- ATF-36163 -- this GaAs PHEMT comes in at low-cost SOT-363 plastic package

• For cordless, cellular and pager applications -- HSMP-386X -- these are low-cost series PIN diodes.

HP currently is producing tens of millions of plastic surface-mount RF semiconductors per month. HP is committed to continuing to meet customer needs for wireless semiconductors.

HP continues to address customer product demands through advanced product research. In addition, HP's participation and membership in several industry associations will help ensure that future wireless components will comply with standards.

The Communication Components Division is part of HP's Components Group, the world's largest independent supplier of communications components. The Components Group, based in San Jose, Calif., includes the Communication Components Division, Optical Communications Division and Optoelectronics Division.

Hewlett-Packard Company is a leading global manufacturer of computing, communications and measurement products and services recognized for excellence in quality and support. HP has 102,300 employees and had revenue of $31.5 billion in its 1995 fiscal year.

Information about HP and its products can be found on the World Wide Web at http://www.hp.com.

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